DARPA’s Defense Sciences Office is seeking abstract proposals for innovative exploratory research concepts in the technical domain of wafer bonding of thin-film crystals.
Specifically, the question to be explored is – To accelerate development and integration of multi-functional materials, how do we create generalizable models to explore thin film crystal bonding onto suitable substrates under diverse real-world process conditions and parameters?
Proposals are expected to dramatically increase the understanding of thin film crystal-substrate wafer bonding through a modelling/simulation framework.
Between USD$100,000 and USD$300,000 is available for projects equivalent to 1 FTE and up to 12 months.
Abstracts will be accepted and assessed on a rolling basis until 16 June 2025.
This Advanced Research Concepts Opportunity is issued under the Master ARC Exploration Announcement DARPA-EA-25-02.
An information webinar will be held 2 April 2025. Non-US citizens must submit a DARPA Form 60 (industry & academia) or a Foreign National Visit Request (government personnel) by 26 March 2025, with webinar registration closing 1 April 2025. More information and register here.
Documents
ARC Opportunity – Crystal: DARPA-EA-25-02-04
Master Solicitation – ARC: DARPA-EA-25-02
