DARPA’s Microsystems Technology Office is seeking innovative proposals in the area of advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing in integrated photonic microsystems. HAPPI is seeking hardware demonstrations of low-loss, high-density optical waveguiding and coupling utilising a scalable manufacturing process that is compatible with microelectronics.
HAPPI will be a 36 month, two-phase program:
Phase 1 – Base – 18 months – feasibility of 3D routing in integrated photonics.
Phase 2 – Option – 18 months – scaling density and proving manufacturability.
Abstracts are due 1 October 2024.
Document
Broad Agency Announcement – HAPPI: HR001124S0038-Amendment-01
