DARPA is seeking submissions of innovative basic or applied research concepts in the technical domain of extreme environment electronics. This μE is issued under the Program Announcement for Microsystems Exploration, DARPA-PA-21-05.
Successful proposals will result in an award of an Other Transaction (OT) for prototype project not to exceed USD$1M over a period of 18 months.
The LADDIS program will demonstrate approaches to fabricate device grade, large diameter, single crystal diamond substrates for use in radio-frequency (RF) and power electronics. Specifically, LADDIS will develop techniques for substrates with diameter greater than 50 mm, dislocation density below 103 cm-2, surface roughness below 0.2 nm, and good electrical, thermal, and mechanical properties.
Phase 1: Develop new processes to form large diameter, low defect density single crystal diamond substrates; develop new polishing methods for diamond substrates.
Phase 2: Refine the Phase 1 growth and polishing techniques to demonstrate device quality, epiready diamond substrates.
– Proposals due 14 April 2023;,HR001123S0025