DARPA is seeking information on new techniques and approaches to localize faults and characterize defects in 3D heterogeneously integrated microsystems.
This RFI seeks to gather information on:
- new experimental techniques to isolate faults in the functionality of sub-circuits formed in 3DHI systems; and
- new methods capable of identifying and characterizing defects causing faults within 3DHI microsystems.
DARPA is interested in approaches for localization and characterization of a broad range of potential faults. Faults that are observable post-integration (eg, failed interconnects, failing subcircuits that span multiple chiplets) are the key area to focus on. Built-in self-test methods are outside the interest of this RFI.
– Responses due 5 April 2023, DARPA-SN-23-50_Failure_Analysis_RFI