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DARPA – Microsystems Technology Office – High Operational Temperature Sensors (HOTS) – HR001123S0036

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DARPA – Microsystems Technology Office – High Operational Temperature Sensors (HOTS) – HR001123S0036

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DARPA is seeking proposals towards the development of sensor microelectronics consisting of transducers, signal-conditioning microelectronics, and integration that operate at extreme temperatures (ie at least 800 °C).

Performance will be validated with the specific demonstration of a pressure sensor module consisting of integrated transducer and signal-conditioning microelectronics.

HOTS will be a 36-month program with a single technical area (TA) executed across two phases: an 18-month Phase 1 (base) and 18-month Phase 2 (option). A potential program expansion into a third phase is possible depending on success in the first two phases.

Proposals due 15 August 2023.

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Supporting document

Broad Agency Announcement – HR001123S0036

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