DARPA’s Microsystems Technology Office is seeking innovative, post-competitive, awardable solutions that exercise the early-stage version of the NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design with commercial Electronic Design Automation (EDA) tools.
The NGMM program is developing new EDA capabilities, and the first comprehensive multi-physics enabled 3DADK, for the design of advanced mixed-material 3DHI microsystems. Enabling efficient EDA workflows, built around a robust 3D-ADK, is essential to the NGMM program and the sustainability of the resultant high-mix/low-volume pure-play advanced packaging capability. DARPA is interested in awardable solutions to exercise and evaluate the early-stage release of the 3D-ADK and EDA workflow.
DARPA is utilising the ERIS Portal to find potential solutions.
New proposed solutions are to be submitted to Topic Area 2 – Strategic Systems.
Solutions already submitted to ERIS are to notify DARPA via email of their existence.
DARPA will assess proposed solutions on an rolling basis until 31 July 2026.
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Notice of Intent to Review Marketplace Solutions – NGMM – DARPA-SN-26-69
