DARPA’s Multi X Office is seeking innovative proposals that enable compact cold-atom devices and environmentally-decoupled ultra-high Q microelectromechanical (MEMS) and photonics devices through microscale ultra-high-vacuum systems (µUHV).
Perrseus will develop architectures and processes for µUHV (<10 -10 mbar) packages and demonstrate this architecture through the integration of pressure sensors (10 -3 mbar to <10 -10 mbar) consisting of cold-atom neutral/ion quantum sensors, MEMS, and photonic sensors.
Perrseus will develop µUHV packages that simultaneously meet the needs of the MEMS, photonics, and quantum sensing communities. To achieve the required improvement from 10 -3 mbar to < 10 ‑10 mbar in a 5 mL package, performers will have to fundamentally rethink the vacuum packaging architecture, the manufacturing process, the vacuum system components, and prototype new process workflows that simplify fabrication and maintain compatibility across MEMS, photonics, and quantum sensing.
Perrseus is a 42-month program divided into two technical phases, preceded by a security preparation phase if applicable.
- Phase 0 – Security Preparation (if required) – up to 3 months; preparation of cybersecurity and administrative readiness for handling of Controlled Unclassified Information (CMMC Level 2).
- Phase 1 – Process Development – 24 months; base period; demonstrating key elements for the process development of a µUHV system including methodology for measuring the pressure over the entire operational range.
- Phase 2 – µUHV Demonstration – 18 months; option period; demonstrating a µUHV system at manufacturing scale and demonstrating the µUHV system lifetime.
Abstracts (strongly encouraged but not mandatory) are due 3 August 2026.
Intent to propose due 1 September 2026 with full proposals due 23 September 2026.
Document
Program Solicitation – Perrseus – DARPA-PS-26-127
