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DARPA – Structural Evaluation through Non-contact Sensor Embedding (SENSE) – DARPA-PA-23-03-06

Home / Funding Opportunity / DARPA – Structural Evaluation through Non-contact Sensor Embedding (SENSE) – DARPA-PA-23-03-06

DARPA – Structural Evaluation through Non-contact Sensor Embedding (SENSE) – DARPA-PA-23-03-06

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DARPA’s Defense Sciences Office is seeking submissions of innovative basic or applied research concepts in the technical domain of embedded structural health monitoring.

SENSE will explore new approaches to embed sensors within metallic structural components during production.  The focus will be on measuring internal temperature and strain as key state variables for structural performance.

Challenges to be addressed:

  • designing sensors and their placement such that they do not introduce a significant parasitic effect on load-bearing capacity
  • developing a manufacturing approach to embed or directly print sensing elements within an electrically conductive structural metallic part.

SENSE will be a two part program:

  • Base Phase 1 – Feasibility – 12 months, up to USD$600,000
  • Option Phase 2 – Proof of Concept – 12 months, up to USD$400,000

Submissions are due 21 November 2023.

This opportunity is issued under the Disruptioneering Program DARPA-PA-23-03.

 

Read more

Documents

Disruption Opportunity – SENSE : DARPA-PA-23-03-06

Program Announcement – Disruptioneering : DARPA-PA-23-03

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