DARPA is seeking proposals for basic or applied research in the technical domain of multi-scale thermal management.
Proposals must address 2 independent and sequential phases:
Phase1 – Feasibility Study – up to USD$500,000 over 9 months
Phase 2 – Proof of Concept (option) – up to USD$500,000 over 9 months
Phase 1 studies will be evaluated to determine the feasibility of the approach and whether to exercise the Phase 2 option.
This solicitation is part of DARPA Microsystems Exploration DARPA-PA-21-05
Proposers will define a specific transistor architecture (eg, 10nm Intel or 7nm TSMC nodes) for modeling, and propose a circuit element with >250,000 transistors, with significant steady state and dynamic power dissipation characteristics.
- Development of atomistic thermal modeling approaches for nanoscale transistors
- Development of a multi-scale circuit level thermal modeling capability
Proposals are due 15 June 2023.
Thermal Modeling of Nanoscale Transistors: DARPA-PA-21-05-05
Program Announcement – Microsystems Exploration: DARPA-PA-21-05