DARPA – Thermal Modeling of Nanoscale Transistors (Thermonat) – DARPA-PA-21-05-05

DARPA is seeking proposals for basic or applied research in the technical domain of multi-scale thermal management.

Proposals must address 2 independent and sequential phases:

Phase1  – Feasibility Study – up to USD$500,000 over 9 months

Phase 2 – Proof of Concept (option) – up to USD$500,000 over 9 months

Phase 1 studies will be evaluated to determine the feasibility of the approach and whether to exercise the Phase 2 option.

This solicitation is part of DARPA Microsystems Exploration  DARPA-PA-21-05

Proposers will define a specific transistor architecture (eg, 10nm Intel or 7nm TSMC nodes) for modeling, and propose a circuit element with >250,000 transistors, with significant steady state and dynamic power dissipation characteristics.

Technical Challenges

1. Development of atomistic thermal modeling approaches for nanoscale transistors
2. Development of a multi-scale circuit level thermal modeling capability

Proposals are due 15 June 2023.

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Supporting documents

Thermal Modeling of Nanoscale Transistors: DARPA-PA-21-05-05

Program Announcement – Microsystems Exploration: DARPA-PA-21-05