DARPA is seeking information on the state-of-the-art of infrared (IR) focal plane arrays (FPAs) and alternative technologies.
This RFI seeks to survey the industry for available and emerging solutions, understand current capabilities, and identify key performance parameters of systems relevant to advanced sensing applications.
DARPA is interested in understanding trades of cost and area coverage for IR (3-14μm) staring (2-D) and scanning (TDI) focal plane arrays, where the principal axes are FPA size, number of systems, and total procurement cost for an operational capability. All relevant aspects of FPA performance are requested to ensure fair comparison of similar devices. These next-generation sensors may be integrated into a wide range of platforms in terrestrial, maritime, air, and space domains.
Technology Categories of Interest
- Infrared FPAs – all types of IR FPAs, including but not limited to staring and scanning arrays, cooled and uncooled detectors, analog and digital ROICs, and any suitable detector material (eg HgCdTe, InSb, InGaAs, VOx, Type-II Superlattice). Information is sought for focal planes spanning all the wavelengths from 3μm to 14μm. DARPA is also interested in the readout capabilities, to include global shutter, rolling shutter, and time delay and integration (TDI) readouts. Emphasis is placed on devices that are sufficiently mature for system integration.
- Alternative Technologies – DARPA is also interested in any alternative or emerging sensor technologies that perform a similar function to IR FPAs for detecting and imaging infrared radiation. Respondents should provide comprehensive details on these technologies, highlighting how they differ from traditional FPAs and what advantages they may offer.
Responses to this RFI are due 14 August 2026 via email to DARPA-SN-26-94@darpa.mil.
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RFI – Infrared Focal Plane Arrays – DARPA-SN-26-94
