Skip to content

DARPA – Request for Information – Quantum Sensors in a Chip

Home / News / DARPA – Request for Information – Quantum Sensors in a Chip

DARPA – Request for Information – Quantum Sensors in a Chip

twitterlinkedin

The DARPA Microsystems Technology Office is seeking to understand the current state of the art and how recent advances can be leveraged to address the challenges that prevent the realization of fully-integrated quantum systems in chips.

Specifically this RFI is seeking information regarding the integration of quantum systems into a chip, including atom sources, photonic routing, RF control, atomic readout, optical pumping and any necessary bias controls into fully-contained, microfabricated chips.

DARPA is interested in the following classes of quantum systems:

  • thermal atoms/ions
  • thermal atom beams
  • cold atoms/ions
  • solid-state defects

and how these microfabricated quantum chips will be developed to enable sensing applications such as magnetometry, electrometry, gravimetry, timing, inertial measurement units, ionizing radiation detection and reference oscillators.

Responses are due 20 March 2024.

 

Read more

Document

Request for Information – QuSIC: DARPA-SN-24-38

 

You may be also interested in ...