DARPA’s Microsystems Technology Office is seeking to identify the current state-of-the-art and key technical challenges in cryogenic thermal packaging and interconnects.
The goals of this Request for Information (RFI) include, but are not limited to:
- Identification of the best-in-class materials, and approaches for cryogenic microsystems
packaging from 10 mK to 77 K, and - Identification of key challenges in scaling up cryogenic thermal packaging to computing systems that can offer transformative advantages in performance per energy use over current high performance computing platforms.
Approaches already well explored in the published literature or those that promise incremental benefits are not of interest.
Responses to this RFI will be used to select topics for a Cryogenic Microsystems Thermal Packaging workshop to be held on December 2, 2024, in McLean, VA.
Responses are due 4 November 2024 via email to DARPA-SN-24-106@darpa.mil.
Document
Request for Information – Cryogenic Microsystems Thermal Packaging: DARPA-SN-24-106
